Title :
MIL-STD-1772 and the future of military hybrid microelectronics
Author :
Spears, William J.
Author_Institution :
Interpoint Corp., Redmond, WA, USA
Abstract :
The author maintains that three and one-half years since its implementation, MIL-STD-1772 has accomplished its purpose of assuring the highest level of reliability possible in the products of qualified hybrid manufacturers. The author discusses how this has been accomplished and the effects that the MIL specs continue to have on the design and manufacture of military hybrid microelectronics. He discusses the background to the development of the standard and examines its use in conjunction with MIL-M-38510 and MIL-STD-883. He considers the future of military hybrids, looking at five emerging trends: application-specific integrated circuits, multichips, silicon substrates, power hybrids, and fiber optics
Keywords :
circuit reliability; hybrid integrated circuits; military equipment; power integrated circuits; quality control; standards; ASIC; IC design; MIL specs; MIL-M-38510; MIL-STD-1772; MIL-STD-883; application-specific integrated circuits; fiber optics; manufacture; military hybrid microelectronics; military specification; multichips; power hybrids; quality control; reliability; standard; Defense industry; Electronic equipment testing; Hybrid integrated circuits; Manufacturing industries; Microelectronics; Military satellites; Monolithic integrated circuits; Semiconductor device manufacture; US Department of Defense; Underwater vehicles;
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
DOI :
10.1109/ECC.1989.77826
