High conductivity materials systems for advanced hybrids

Author

Borland, W. ; Needes, C.R.S. ; Siuta, V.P. ; Nair, K.M.

Author_Institution

E.I. Du Pont de Nemours, Wilmington, DE, USA

fYear

1989

fDate

22-24 May 1989

Firstpage

704

Lastpage

713

Abstract

Two materials systems developed to meet the circuit density, cost, and reliability requirements of the future are discussed. High conductivity, high-resolution copper and silver-bearing conductors, dielectrics meeting more stringent reliability requirements, and resistors demonstrating excellent post trim stability are elements of these systems. The technology used in these systems is considered, with particular emphasis on new conductor and dielectric materials. Reliability data showing twenty-year operating life predictions are presented. Materials technology and its relationship to the reliability of hybrids are discussed

Keywords

circuit reliability; dielectric materials; hybrid integrated circuits; integrated circuit technology; integrated circuit testing; life testing; metallisation; thick film circuits; 20 y; Ag bearing conductors; Cu bearing conductors; Series Q materials systems; circuit density; cost; dielectrics; high conductivity materials systems; hybrid microcircuits; operating life predictions; post trim stability; reliability requirements; resistors; thick film circuits; Circuits; Conducting materials; Conductivity; Conductors; Copper; Costs; Dielectric materials; Nonhomogeneous media; Quadratic programming; Resistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77828

Filename

77828