High performance HMIC packaging for telecom applications

Author

Bellardo, A. ; Parafioriti, G. ; Villa, S.

Author_Institution

Telettra SpA, Milan, Italy

fYear

1989

fDate

22-24 May 1989

Firstpage

714

Lastpage

718

Abstract

The technical solutions used to develop a family of hybrid microwave integrated circuits, named micromodules, for the frequency range from 4 GHz to 23 GHz are described. Some of the most significant steps of the assembly and packaging process are examined. The discussion covers: package construction and performance; an investigation of the die attachment with either epoxy or eutectic material; a comparison of three different techniques for measuring thermal resistance; and an original method of tuning the circuits that allows for process automation

Keywords

hybrid integrated circuits; integrated circuit technology; microassembling; microwave integrated circuits; microwave links; modules; packaging; thin film circuits; tuning; 4 to 23 GHz; HMIC; SHF; assembly; die attachment; epoxy; eutectic material; hybrid MIC; micromodules; microwave integrated circuits; packaging; process automation; telecom applications; thermal resistance measurement; thin film circuits; tuning; Assembly; Building materials; Circuit optimization; Electrical resistance measurement; Frequency; Hybrid integrated circuits; Integrated circuit packaging; Microwave integrated circuits; Telecommunications; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77829

Filename

77829