High-performance power package for power-integrated circuit devices

A high-performance version of a plastic dual-in-line package with improved reliability levels, which was developed for high-power integrated circuit industrial and automotive applications, is discussed. Superior thermal capability and reliability performance have been achieved with no increase in manufacturing cost or change in package outline. The development of the package is based on a package optimization approach. Development methodology and package characterization results are outlined. Data for production lots of the package show a thermal performance improvement of up to 35% compared with currently available packages, without the aid of an external heat sink. Qualification test results indicate that the package has an excellent reliability performance, its long-term survival exceeding the industry standard requirements. An improvement by a factor of four in resistance to device metal deformation and a factor of five in wire bond thermal fatigue has been achieved by reducing the shear and normal stresses inside the package by proper selection of a low-modulus molding compound and optimizing the lead-frame design