Title :
Strategic logistics outsourcing: An integrated QFD and AHP approach
Author :
Ho, W. ; Bennett, D.J. ; Mak, K.L. ; Chuah, K.B. ; Lee, C.K.M. ; Hall, M.J.
Author_Institution :
Aston Bus. Sch., Aston Univ., Birmingham, UK
Abstract :
Third-party logistics service providers (3PLs) play a vital role in contemporary supply chain management. Evaluation and selection of the right 3PLs depends on a wide range of quantitative and qualitative criteria rather than cost-based factors. Although various multi-criteria decision making approaches have been proposed, they have not considered the impact of business objectives and requirements of company stakeholders on the evaluating criteria. To enable the ¿voice¿ of company stakeholders is considered, this paper develops an integrated approach for selecting 3PL strategically. In the approach, multiple evaluating criteria are derived from the requirements of company stakeholders using a series of house of quality (HOQ). The importance of evaluating criteria is prioritized with respect to the degree of achieving the stakeholder requirements using analytic hierarchy process (AHP). Based on the ranked criteria, alternative 3PLs are evaluated and compared with each other using AHP again to make an optimal selection.
Keywords :
logistics; outsourcing; quality function deployment; service industries; statistical analysis; AHP; QFD; analytic hierarchy process; business objectives; company stakeholders; house of quality; quality function deployment; service providers; strategic logistics outsourcing; supply chain management; third-party logistics; Artificial neural networks; Companies; Data envelopment analysis; Decision making; Logistics; Outsourcing; Performance evaluation; Quality function deployment; Research and development management; Transportation; Logistics outsourcing; analytic hierarchy process; evaluation; quality function deployment; selection; third-party logistics service providers;
Conference_Titel :
Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-4869-2
Electronic_ISBN :
978-1-4244-4870-8
DOI :
10.1109/IEEM.2009.5373059