Title :
Surface mount type SAW filter for hand-held telephones
Author :
Suma, Shuji ; Gunji, Katsuhiko ; Tagami, Toshio ; Sakamoto, Yoshinobu
Author_Institution :
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
Abstract :
In the development of a surface mount type SAW filter, we adopted a packaging method to seal a ceramic lid to a laminated ceramic base board by high temperature soldering. The problems of this structure are chip pattern shorts caused by solder splashing during sealing, the heat resistance of bonding pads, and the electromagnetic shielding properties of the package. To solve these problems we created a protective film for the SAW chip, and made the film a heat resistant structure. An electromagnetic shielding property was added by creating a conductive film on the lid
Keywords :
UHF filters; assembling; cellular radio; electromagnetic shielding; protective coatings; soldering; surface acoustic wave filters; surface mount technology; EM shielding; SAW filter; bonding pads; ceramic lid; chip pattern shorts; conductive film; electromagnetic shielding properties; hand-held telephones; heat resistance; high temperature soldering; laminated ceramic base board; packaging method; protective film; sealing; solder splashing; surface mount type; Ceramics; Electromagnetic shielding; Packaging; Resistance heating; SAW filters; Seals; Soldering; Surface resistance; Telephony; Temperature;
Conference_Titel :
Ultrasonics Symposium, 1995. Proceedings., 1995 IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-2940-6
DOI :
10.1109/ULTSYM.1995.495530
