• DocumentCode
    2967510
  • Title

    Brazing to low-temperature fired thick films

  • Author

    Keusseyan, R.L. ; Marsh, W.E. ; Prados, R.A. ; Hirsch, R.G.

  • Author_Institution
    DuPont Electron., Research Triangle Park, NC, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    743
  • Lastpage
    747
  • Abstract
    The development of materials and processes for brazing, leads, pins, and heat sinks to alumina ceramic substrates is discussed. The substrates are metallized using either copper-, silver- or gold-based thick film pastes that are fired in the 850-950°C temperature range. The metal ceramic joint strengths obtained are comparable to those obtained using high-temperature fired tungsten or molybdenum-based metallizations
  • Keywords
    alumina; brazing; ceramics; integrated circuit technology; substrates; thick film circuits; 850 to 950 degC; Ag based pastes; Al2O3; Au based pastes; Cu based pastes; alumina ceramic substrates; brazing; heat sinks; leads; low-temperature fired; metal ceramic joint strengths; pins; thick films; Atmosphere; Ceramics; Copper; Heat sinks; Inorganic materials; Lead; Metallization; Pins; Substrates; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components Conference, 1989. Proceedings., 39th
  • Conference_Location
    Houston, TX
  • Type

    conf

  • DOI
    10.1109/ECC.1989.77833
  • Filename
    77833
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2967510