• DocumentCode
    2967533
  • Title

    PZT material properties at UHF and microwave frequencies derived from FBAR measurements

  • Author

    Larson, John D., III ; Gilbert, Stephen R. ; Xu, Baomin

  • Author_Institution
    Agilent Labs., Palo Alto, CA, USA
  • Volume
    1
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    173
  • Abstract
    Lead zirconate titanate (PZT) is a high dielectric constant, εrS, high coupling, kt2, piezoelectric material with possible application to film bulk acoustic resonators (FBAR) at low microwave frequencies. PZT is a widely used material at audio and low MHz range frequencies, but the high acoustic attenuation of PZT tends to preclude its use above UHF. Likewise, the bulk dielectric/piezoelectric/elastic (DPE) properties are well known at low frequencies, but the thin film properties have not been as well measured into the microwave range. To obtain better data, the material properties of thin film PZT deposited by several methods were measured at GHz frequencies from air- or silicon-backed FBARs fabricated on silicon wafers. PZT thin films, deposited by metal-organic chemical vapor deposition (MOCVD), sol-gel deposition, RF sputtering, or jet vapor deposition, were obtained from various sources. The films examined ranged from 0.4 to 2 μm in thickness, and were deposited on thin (∼0.1 μm) Pt or Ir bottom electrodes. The samples had compositions within the tetragonal phase (Zr/Ti = 30/70, 40/60) or near the morphotropic phase boundary (Zr/Ti = 50/50). Scattering parameter, S11, vs frequency measurements were made. Using the Mason equivalent circuit model, the DPE coefficients were extracted by varying parameters in the Mason model until the predicted S11 vs frequency fitted the measured data. The devices exhibited εrS in the range of 300 to 500, kt2 between 5% and 35%, and acoustic attenuation from 400 to 2100 dB/cm at 1 GHz.
  • Keywords
    MOCVD; S-parameters; acoustic resonators; equivalent circuits; ferroelectric materials; lead compounds; piezoelectric materials; piezoelectric thin films; silicon; sol-gel processing; sputter deposition; substrates; 0.4 to 2 micron; 1 GHz; Ir; MOCVD; Mason equivalent circuit model; PZT; PZT material properties; PbZrO3TiO3; Pt; RF sputtering; Si; UHF; acoustic attenuation; bulk properties; dielectric/piezoelectric/elastic properties; ferroelectric material; film bulk acoustic resonators; iridium bottom electrodes; jet vapor deposition; lead zirconate titanate; microwave frequencies; morphotropic phase; piezoelectric material; platinum bottom electrodes; scattering parameter; silicon substrate; silicon wafers; sol-gel deposition; tetragonal phase; thin film properties; Acoustic measurements; Dielectric measurements; Dielectric thin films; Film bulk acoustic resonators; Frequency measurement; Material properties; Microwave frequencies; Microwave measurements; Sputtering; UHF measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1417696
  • Filename
    1417696