DocumentCode
2967582
Title
Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium
fYear
1997
fDate
13-15 Oct. 1997
Abstract
The following topics were dealt with: reliability; assembly processes; semiconductor processing; environmentally conscious manufacturing; test, inspection and characterization; packaging; contract manufacturing; flip chip; sub-0.25 μm lithography; ball grid array; scheduling in semiconductor manufacturing; life-long learning.
Keywords
manufacture; assembly; ball grid array; contract manufacturing; electronic manufacturing technology; environmental factors; flip chip; inspection; lithography; packaging; reliability; scheduling; semiconductor processing; testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location
Austin, TX, USA
ISSN
1089-8190
Print_ISBN
0-7803-3929-0
Type
conf
DOI
10.1109/IEMT.1997.626856
Filename
626856
Link To Document