Title :
High SAW velocity and high electromechanical coupling coefficient with the new three layered structure: ZnO/AlN/diamond
Author :
El Hakiki, M. ; Elmazria, O. ; Assouar, M.B. ; Mortet, V. ; Talbi, A. ; Sarry, F.
Author_Institution :
Lab. de Phys. des Milieux Ionises et Applications, Univ. Henri Poincare, Vandoeuvre-les-Nancy, France
Abstract :
A new diamond based SAW device layered structure, combining high acoustic velocity (Vφ) and high electromechanical coupling coefficient (K-), is investigated for GHz-band applications. In fact, to overcome the trade-off relationship between Vφ and K2, we propose the use of a three-layer structure ZnO/AlN/diamond that combine the advantages of both piezoelectric materials: high K2 of ZnO and high velocity of AlN. A theoretical study based on the Campbell and Jones model was performed to calculate the phase velocity and K2 dispersion curves of the Rayleigh mode; its higher modes as well as the leaky waves generated in this structure. Three configurations depending on IDT position in the structure: ZnO surface, ZnO/AlN or AlN/diamond interfaces were calculated considering various thicknesses of ZnO and AlN layers. Both high values of K2 larger than 4%, and of Vφ more than 15 km/s are expected on this new structure according to the theoretical results.
Keywords :
Rayleigh waves; aluminium compounds; diamond; inhomogeneous media; interdigital transducers; piezoelectric devices; piezoelectric materials; surface acoustic wave devices; ultrasonic dispersion; zinc compounds; 15 km/s; Campbell/Jones model; IDT position; Rayleigh mode phase velocity; SAW device layered structure; ZnO-AlN-C; dispersion curves; electromechanical coupling coefficient; high SAW velocity structure; leaky waves; piezoelectric materials; Acoustic applications; Acoustic devices; Ferroelectric materials; High K dielectric materials; High-K gate dielectrics; Piezoelectric films; Piezoelectric materials; Surface acoustic wave devices; Surface acoustic waves; Zinc oxide;
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
Print_ISBN :
0-7803-8412-1
DOI :
10.1109/ULTSYM.2004.1417700