Electrical characterization of POLYHIC, a high density, high frequency, interconnection and packaging medium for digital circuits

A family of multilayer hybrid integrated circuits called POLYHIC is discussed. The circuits use thin-film technology on an alumina substrate with triazine-based, photodefinable, polymer dielectric layers. This family provides high-interconnection-density packages with desirable electrical properties. High-frequency applications exploit the ability of this package to provide a controlled-impedance, low-loss environment with terminations very close to the silicon devices. A program was conducted to characterize transmission line effects for high-data-rate applications of the package. The results are presented as design capabilities, based on the conductor and dielectric properties, that will ensure required product characteristic impedance and attenuation factors. Single-ended and coupled-pair transmission lines are discussed. The package´s dependence on electrical properties as a function of key parameters is examined. Experimental verification of pulse behavior is presented. The POLYHIC family can support high-fidelity pulses at typical data rates of more than 2 Gb/s with signal risetimes of 100 ps