• DocumentCode
    2968535
  • Title

    Significance of shields in high voltage performance of vacuum interrupters

  • Author

    Kulkarni, Santosh ; Hemachander, M. ; Kumar, Ajit ; Saravanan, S. ; Acharya, Viren ; Rayudu, Srinivas

  • Author_Institution
    Global R&D center, Crompton Greaves Ltd., Mumbai, India
  • fYear
    2012
  • fDate
    2-7 Sept. 2012
  • Firstpage
    57
  • Lastpage
    59
  • Abstract
    Vacuum Interrupters use a metallic cylinder to shield the ceramic from the metal vapor during arcing. Rightly so, this metallic cylinder is termed as “shield” or “arcing shield” or “vapor condensing shield”. This shield plays an equally important role in the high voltage performance of the vacuum interrupter. The number, position, dimensions and profiles of these shields govern the electrostatic field distribution and hence the high voltage performance of the vacuum interrupter. The high voltage performance of the vacuum interrupter is evaluated through analytical means like FEM simulations and high voltage tests. This paper presents the significance of the shield through results of electrostatic simulations and experimental results of commercial vacuum interrupters with various combinations of shields. The paper also presents the role of multiple shields, especially for higher voltage interrupters. A case study, highlighting the importance of the annular gap between contacts and shield for the impulse voltage performance of the contacts is also presented in this paper.
  • Keywords
    finite element analysis; vacuum arcs; vacuum interrupters; FEM simulations; arcing shield; contact impulse voltage performance; electrostatic field distribution; electrostatic simulations; high-voltage performance; high-voltage tests; metal vapor; metallic cylinder; vacuum interrupters; vapor condensing shield; Bellows; Ceramics; Electric potential; Electrodes; Electrostatics; Interrupters; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
  • Conference_Location
    Tomsk
  • ISSN
    1093-2941
  • Print_ISBN
    978-1-4673-1263-9
  • Electronic_ISBN
    1093-2941
  • Type

    conf

  • DOI
    10.1109/DEIV.2012.6412449
  • Filename
    6412449