DocumentCode :
2968598
Title :
Integrated ultrasonic imaging systems based on CMUT arrays: recent progress
Author :
Wygant, I.O. ; Zhuang, X. ; Yeh, D.T. ; Nikoozadeh, A. ; Oralkan, O. ; Ergun, A.S. ; Karaman, M. ; Khuri-Yakub, B.T.
Author_Institution :
E.L. Ginzton Lab., Stanford Univ., CA, USA
Volume :
1
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
391
Abstract :
The paper describes the development of an ultrasonic imaging system based on a two-dimensional capacitive micromachined ultrasonic transducer (CMUT) array. The transducer array and front-end electronics are designed to fit in a 5-mm endoscopic channel. A custom-designed integrated circuit, which comprises the front-end electronics, is connected with the transducer elements via through-wafer interconnects and flip-chip bonding. FPGA-based signal-processing hardware provides real-time three-dimensional imaging. The imaging system is being developed to demonstrate a means of integrating the front-end electronics with the transducer array and to provide a clinically useful technology. Integration of the electronics can improve signal-to-noise ratio, reduce the number of cables connecting the imaging probe to a separate processing unit, and provide a means of connecting electronics to large two-dimensional transducer arrays. The paper describes the imaging system architecture and the progress we have made on implementing each of its components: a 16×16 CMUT array; custom-designed integrated circuits; a flip-chip bonding technique; signal-processing hardware.
Keywords :
array signal processing; biomedical ultrasonics; bonding processes; capacitive sensors; field programmable gate arrays; flip-chip devices; image processing equipment; image reconstruction; integrated circuit design; integrated circuit interconnections; microsensors; ultrasonic transducer arrays; 5 mm; CMUT arrays; FPGA-based signal-processing hardware; Stanford Medical School; capacitive micromachined ultrasonic transducer array; custom-designed integrated circuit; endoscopic channel; flip-chip bonding; front-end electronics; image reconstruction; imaging probe; integrated ultrasonic imaging systems; real-time three-dimensional imaging; through-wafer interconnects; Bonding; Cables; Hardware; Integrated circuit interconnections; Joining processes; Probes; Signal to noise ratio; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1417745
Filename :
1417745
Link To Document :
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