DocumentCode :
2968943
Title :
RF-SAW filters on pyro-suppressed wafers
Author :
Vetelino, K. ; Welsh, P. ; Aguirre, M. ; Abbott, B.
Author_Institution :
Sawtek Inc., Orlando, FL, USA
Volume :
1
fYear :
2004
fDate :
23-27 Aug. 2004
Firstpage :
449
Abstract :
The paper describes the problems associated with manufacturing RF-SAW filters on pyroelectric substrates. The presence of the pyroelectric effect on leaky cuts of LiTaO3 results in manufacturing yield problems for RF-SAWs in the frequency range of 800 MHz to 2.4 GHz. The effect is more significant at higher frequencies (above 2 GHz) where yield fallout from pyroelectric related damage can be as high as 30%. Common layout and metalization techniques used to counter the pyroelectric related damage result in degraded electrical performance and compromise design flexibility. The use of pyro-suppressed LiTaO3 reduces the yield fallout dramatically. RF L-SAW filters have been fabricated using 42°, 46° and 48° LiTaO3 with no observable changes in electrical performance or temperature coefficient of frequency. The ideal bulk conductivity range for pyro-suppressed LiTaO3 needs to be determined. Modeling of pyroelectric charge build up on the metalized die surface can also aid designers in developing device layouts that are less susceptible to pyroelectric related damage.
Keywords :
lithium compounds; pyroelectricity; surface acoustic wave filters; 800 MHz to 2.4 GHz; LiTaO3; RF-SAW filters; bulk conductivity range; degraded electrical performance; layout techniques; leaky SAW filters; metalization techniques; pyro-suppressed lithium tantalate substrates; pyroelectric charge build; pyroelectric substrates; yield fallout; Digital communication; Electrodes; Fabrication; Geometry; Manufacturing; Pyroelectricity; Radio frequency; SAW filters; Surface acoustic waves; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-8412-1
Type :
conf
DOI :
10.1109/ULTSYM.2004.1417759
Filename :
1417759
Link To Document :
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