DocumentCode :
2969270
Title :
Effects of trace Te on the anti-welding property of Cu-30CrTe alloy contact material
Author :
Baihe Miao ; Jinglin Xie ; Jianping He ; Guoxun Liu ; Wenbin Wang ; Xiaojun Wang
Author_Institution :
Univ. of Sci. & Technol. Beijing, Beijing, China
fYear :
2012
fDate :
2-7 Sept. 2012
Firstpage :
189
Lastpage :
192
Abstract :
Tensile fracture at room temperature and the faying microstructures of vacuum casting Cu-30CrTe, Cu-30Cr and sintered CuCr25 contact materials after diffusion welding in vacuum were evaluated by Optical Microscope and SEM. It is shown that there are different fracture characteristics in the three contact materials, and distinct microstructures formed at the faying surface of the Cu-30CrTe from that of the Cu-30Cr and sintered CuCr25. Consulting the XPS surface analysis results of elemental distribution and valence state of trace Te in the Cu-30CrTe contact material, the mechanism and principles of trace Te improving anti-welding property of Cu-30CrTe contact material are discussed.
Keywords :
X-ray photoelectron spectra; chromium alloys; copper alloys; fracture; scanning electron microscopy; sintering; tellurium alloys; tensile strength; vacuum casting; Cu-CrTe; SEM; XPS surface analysis; anti-welding property; diffusion welding; elemental distribution; faying microstructures; faying surface; fracture characteristics; optical microscope; sintered contact materials; tensile fracture; vacuum casting; valence state; Contacts; Materials; Rough surfaces; Surface cracks; Surface roughness; Surface treatment; Welding; CuCr contact material; X-ray photoelectron spectroscopy (XPS); anti-welding property; faying surface microstructure; fracture characteristics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
Conference_Location :
Tomsk
ISSN :
1093-2941
Print_ISBN :
978-1-4673-1263-9
Electronic_ISBN :
1093-2941
Type :
conf
DOI :
10.1109/DEIV.2012.6412484
Filename :
6412484
Link To Document :
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