Title :
3DIC multi-project-wafer program: A collaboration to provide fabrication access
Abstract :
A collection of slides from the author´s conference presentation is given. The following topics are discussed: 3DIC multiproject-wafer program; CMP/CMC/MOSIS; MOSIS multiproject wafer; Tezzaron 3DIC technology; silicon workbench for photonics; and silicon workbench for MEMS and III-V compound semiconductors.
Keywords :
III-V semiconductors; chemical mechanical polishing; elemental semiconductors; integrated circuit design; micromechanical devices; silicon; three-dimensional integrated circuits; 3DIC multiproject-wafer program; CMC; CMP; III-V compound semiconductor; MEMS; MOSIS multiproject wafer; Tezzaron 3DIC technology; photonics; silicon workbench; Collaboration; Fabrication; Foundries; Mirrors; Physics;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751416
