DocumentCode :
2969553
Title :
Development of alumina green sheet for tight dimensional tolerance LSI packages
Author :
Shirai, Masahiro ; Otagiri, Tadashi
Author_Institution :
NGK Insulators Ltd., Nagoya, Japan
fYear :
1989
fDate :
22-24 May 1989
Firstpage :
840
Lastpage :
846
Abstract :
Acrylic resin was selected and its functional group and monomer optimized to develop alumina green sheet for tight-dimensional-tolerance LSI packages. The carboxyl group was found to be the most suitable functional group for obtaining a well-dispersed slurry and high stable green sheet density for alumina powder. A polymerized acrylic resin was found to be given the best pyrolysis behavior. The fired shrinkage of the thin green sheet (0.5 mm) and the laminated thick green sheet (5.0 mm) were the same when this resin was used. The green sheet using this acrylic resin polymerized with a small amount of carboxyl functional group shows stable, fired shrinkage that is largely independent of raw material lots, tape casting lots, and green sheet thickness. As a result, fluctuation of the fired shrinkage is within ±0.1%. Pin grid arrays with 400 pins and 100-mil pitch per 4-mil line pitch can be produced by this green sheet, which is acceptable for tight dimensional tolerances
Keywords :
alumina; integrated circuit technology; large scale integration; packaging; 0.5 mm; 5 mm; Al2O3; LSI packages; PGA; alumina green sheet; carboxyl functional group; dimensional tolerance; fired shrinkage; laminated thick green sheet; monomer optimisation; pin grid arrays; polymerized acrylic resin; pyrolysis behavior; thin green sheet; well-dispersed slurry; Electronics packaging; Fluctuations; Large scale integration; Pins; Polymers; Powders; Raw materials; Resins; Slurries; Tape casting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components Conference, 1989. Proceedings., 39th
Conference_Location :
Houston, TX
Type :
conf
DOI :
10.1109/ECC.1989.77843
Filename :
77843
Link To Document :
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