• DocumentCode
    2969600
  • Title

    Relationship between knowledge sharing and absorptive capacity moderated by organizational and technology factors: a conceptual model

  • Author

    Andrawina, Luciana

  • Author_Institution
    Ind. Eng., Bandung Inst. of Technol., Bandung, Indonesia
  • fYear
    2009
  • fDate
    8-11 Dec. 2009
  • Firstpage
    1865
  • Lastpage
    1869
  • Abstract
    The current tougher competition has established the leading role of knowledge as the capital in order to gain competitive advantage. Knowledge has become significant resources to the company to innovate continuously. Knowledge is embedded in the employees and created by the employees as well; therefore, the companies´ ability to innovate will depend on its employee´s knowledge sharing behavior and absorptive capacity. This study develops a conceptual model to explain the relationship between knowledge sharing and absorptive capacity influenced by moderating variables, namely organizational factor and technology factor. Knowledge sharing which consists of donating and collecting knowledge is considered to have influence towards the employee´s motivation and ability. The two moderating variables considered in this study are top management support from organizational factor and information and communication use from technology factor.
  • Keywords
    knowledge management; organisational aspects; personnel; technology management; absorptive capacity; competitive advantage; employee motivation; employees; information and communication use; knowledge sharing; organizational factor; technology factor; Communications technology; Humans; Industrial engineering; Knowledge management; Process planning; Resource management; Strategic planning; Technological innovation; Technology management; Telecommunications; Knowledge sharing; absorptive capacity; organizational factor; technology factor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-4869-2
  • Electronic_ISBN
    978-1-4244-4870-8
  • Type

    conf

  • DOI
    10.1109/IEEM.2009.5373192
  • Filename
    5373192