Title :
3D integration infrastructure & market status
Author :
Zinck, Christophe
Abstract :
A collection of slides for the author´s conference is presented. Topic discussed is about 3D integration infrastructure and its market status.
Keywords :
integrated circuit manufacture; packaging; semiconductor industry; 3D IC market; 3D integration infrastructure; packaging; CMOS image sensors; Driver circuits; Investments; Silicon; Three dimensional displays; Through-silicon vias;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751425
