DocumentCode :
2969743
Title :
Cost effectiveness of 3D integration options
Author :
Velenis, Dimitrios ; Marinissen, Erik Jan ; Beyne, Eric
Author_Institution :
imec, Leuven, Belgium
fYear :
2010
fDate :
16-18 Nov. 2010
Firstpage :
1
Lastpage :
6
Abstract :
The available manufacturing options for 3D integration have different impact on the cost of a 3D-stacked system. Using the 3D cost model developed at imec, the cost of different technology integration options is analyzed and the cost effectiveness of different technology solutions is compared. The cost model is based on imec´s 3D integration process flows and includes the cost of manufacturing equipment, fabrication facilities, personnel, and materials. A breakdown of different 3D processing steps into these costs is presented. Furthermore, the effect of different TSV geometries on system manufacturability and cost is investigated. The effectiveness of different TSV redundancy and repair approaches is evaluated and their impact on system cost is also discussed.
Keywords :
three-dimensional integrated circuits; 3D cost model; 3D integration option; 3D integration process flow; 3D-stacked system; TSV geometry; TSV redundancy; system cost; system manufacturability; technology integration option; Bonding; Maintenance engineering; Redundancy; Solid modeling; Stacking; Three dimensional displays; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
Type :
conf
DOI :
10.1109/3DIC.2010.5751428
Filename :
5751428
Link To Document :
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