• DocumentCode
    2969743
  • Title

    Cost effectiveness of 3D integration options

  • Author

    Velenis, Dimitrios ; Marinissen, Erik Jan ; Beyne, Eric

  • Author_Institution
    imec, Leuven, Belgium
  • fYear
    2010
  • fDate
    16-18 Nov. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The available manufacturing options for 3D integration have different impact on the cost of a 3D-stacked system. Using the 3D cost model developed at imec, the cost of different technology integration options is analyzed and the cost effectiveness of different technology solutions is compared. The cost model is based on imec´s 3D integration process flows and includes the cost of manufacturing equipment, fabrication facilities, personnel, and materials. A breakdown of different 3D processing steps into these costs is presented. Furthermore, the effect of different TSV geometries on system manufacturability and cost is investigated. The effectiveness of different TSV redundancy and repair approaches is evaluated and their impact on system cost is also discussed.
  • Keywords
    three-dimensional integrated circuits; 3D cost model; 3D integration option; 3D integration process flow; 3D-stacked system; TSV geometry; TSV redundancy; system cost; system manufacturability; technology integration option; Bonding; Maintenance engineering; Redundancy; Solid modeling; Stacking; Three dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2010 IEEE International
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4577-0526-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2010.5751428
  • Filename
    5751428