DocumentCode
2969743
Title
Cost effectiveness of 3D integration options
Author
Velenis, Dimitrios ; Marinissen, Erik Jan ; Beyne, Eric
Author_Institution
imec, Leuven, Belgium
fYear
2010
fDate
16-18 Nov. 2010
Firstpage
1
Lastpage
6
Abstract
The available manufacturing options for 3D integration have different impact on the cost of a 3D-stacked system. Using the 3D cost model developed at imec, the cost of different technology integration options is analyzed and the cost effectiveness of different technology solutions is compared. The cost model is based on imec´s 3D integration process flows and includes the cost of manufacturing equipment, fabrication facilities, personnel, and materials. A breakdown of different 3D processing steps into these costs is presented. Furthermore, the effect of different TSV geometries on system manufacturability and cost is investigated. The effectiveness of different TSV redundancy and repair approaches is evaluated and their impact on system cost is also discussed.
Keywords
three-dimensional integrated circuits; 3D cost model; 3D integration option; 3D integration process flow; 3D-stacked system; TSV geometry; TSV redundancy; system cost; system manufacturability; technology integration option; Bonding; Maintenance engineering; Redundancy; Solid modeling; Stacking; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location
Munich
Print_ISBN
978-1-4577-0526-7
Type
conf
DOI
10.1109/3DIC.2010.5751428
Filename
5751428
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