Title :
Flip-chip-on-board (FCOB) assembly and reliability
Author :
Yegnasubramanian, S. ; Deshmukh, R. ; Fulton, J. ; Fanucci, R. ; Gannon, J. ; Morris, J.R. ; Nikmanesh, Khalil
Author_Institution :
Lucent Technol., Princeton, NJ, USA
Abstract :
This paper discusses the methods of direct chip attachment (DCA) and the results of interconnect reliability qualification of flip chip assemblies with underfill. The method developed provides a `dropin´ surface mount process to attach bumped silicon devices to laminates utilizing standard surface mount assembly equipment. Assemblies of test vehicles and product modules demonstrated satisfactory results in all of the reliability qualification and product conformance criteria. Results of failure mode analysis (FMA) of assemblies subjected to thermal stress are discussed
Keywords :
assembling; failure analysis; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; laminates; surface mount technology; thermal stresses; FCOB; assembly; direct chip attachment; dropin surface mount process; failure mode analysis; flip-chip-on-board; interconnect reliability qualification; laminates; product conformance criteria; reliability; reliability qualification; standard surface mount assembly equipment; test vehicles; thermal stress; underfill; Assembly; Failure analysis; Flip chip; Laminates; Qualifications; Silicon devices; Standards development; Testing; Thermal stresses; Vehicles;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626870
