• DocumentCode
    2970146
  • Title

    Influence of contact solid angle on anode spot formation threshold current in vacuum circuit breakers

  • Author

    Guowei Kong ; Zhiyuan Liu ; Yingsan Geng ; Hui Ma ; Xiaohui Xue

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2012
  • fDate
    2-7 Sept. 2012
  • Firstpage
    333
  • Lastpage
    336
  • Abstract
    The objective of this paper is to experimentally understand a relationship between anode spot formation threshold current Ith and a contact solid angle in vacuum arcs subjected to an axial magnetic field (AMF). Experiments were performed in a demountable vacuum chamber, in which an axial magnetic field coil was installed coaxially with a pair of butt contacts. Solid angle Ω is subtended by the anode of the cathode center In the experiment, butt type contacts with contact material CuCr25 and contact diameter 12 mm, 25 mm, 40mm, 60mm and 80 mm were tested. At the end of arcing, the contact separation was about 12~24 mm determined by an opening velocity with arcing time about 10 ms. The AMF applied to the pair of butt type contact was adjusted from 0 to 122 mT. Arc current was tested up to 30 kA at 50 Hz. The results showed that anode spot formation threshold current Ith was linearly proportional to not only contact solid angle but also the AMF applied. Besides, the influence of contact separation length on Ith was not as significant as that of contact diameter. With increasing of AMF, the anode surface temperature at current zero in the condition of Ith declined and also the temperature distribution tended to shrink.
  • Keywords
    copper compounds; vacuum circuit breakers; anode spot formation; axial magnetic field coil; butt contacts; contact diameter; contact solid angle; threshold current; vacuum circuit breakers; Anodes; Interrupters; Magnetic fields; Plasmas; Solids; Threshold current; Vacuum arcs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2012 25th International Symposium on
  • Conference_Location
    Tomsk
  • ISSN
    1093-2941
  • Print_ISBN
    978-1-4673-1263-9
  • Electronic_ISBN
    1093-2941
  • Type

    conf

  • DOI
    10.1109/DEIV.2012.6412521
  • Filename
    6412521