Title :
Wireless power transfer using resonant inductive coupling for 3D integrated ICs
Author :
Han, Sangwook ; Wentzloff, David D.
Author_Institution :
Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
In this paper we introduce a wireless power transfer scheme using resonant inductive coupling for 3DICs to enhance power transfer efficiency and power transfer density with smaller coils. Numerical analysis and optimal conditions are presented for both power transfer efficiency and density. HFSS simulation results are shown to verify the theoretical results. Coils for the power link are designed using a Chartered 0.13μm CMOS process. The peak power transfer efficiency is 52% and power transfer density is 49mW/mm2.
Keywords :
CMOS integrated circuits; coupled circuits; equivalent circuits; inductive power transmission; numerical analysis; three-dimensional integrated circuits; 3D integrated IC; Chartered CMOS process; HFSS simulation results; numerical analysis; optimal conditions; power link; power transfer density; power transfer efficiency; resonant inductive coupling; size 0.13 mum; wireless power transfer; Coils; Couplings; Equivalent circuits; Integrated circuit modeling; Simulation; Wireless communication; Wireless sensor networks;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2010 IEEE International
Conference_Location :
Munich
Print_ISBN :
978-1-4577-0526-7
DOI :
10.1109/3DIC.2010.5751455
