DocumentCode
2970699
Title
Developing aged SPICE model for hot carrier reliability simulation
Author
Ye, Qiuyi ; Terletzki, H. ; Tonti, W.
Author_Institution
Infineon Technol., Hopewell Junction, NY, USA
fYear
2000
fDate
2000
Firstpage
153
Lastpage
154
Abstract
A systematic method to develop aged SPICE model for hot carrier reliability simulation is proposed in this paper. This method not only simplifies the aged model develop procedure, but also solves the problem of modeling reverse stress mode and have good model scalability
Keywords
SPICE; ageing; hot carriers; integrated circuit modelling; integrated circuit reliability; aged SPICE model; hot carrier reliability simulation; reverse stress mode; scalability; Aging; Curve fitting; Data mining; Degradation; Differential equations; Hot carriers; Microelectronics; SPICE; Scalability; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2000 IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-6392-2
Type
conf
DOI
10.1109/IRWS.2000.911926
Filename
911926
Link To Document