High-reliability epoxy molding compound for surface-mounted devices

Author

Kuroki, S. ; Oota, K.

Author_Institution

Sumitomo Bakelite Co. Ltd., Tochigi, Japan

fYear

1989

fDate

22-24 May 1989

Firstpage

885

Lastpage

890

Abstract

Surface-mount packages are subjected to high levels of thermal stress in mounting, which causes package cracking or lowering of the humidity resistance after mounting. These modes of deterioration are studied experimentally and theoretically by considering the stress characteristics of molding compounds at high temperatures. The study indicated that both low stress and high strength of molding compounds at high temperature are significant causes of quality deterioration in mounting. The characteristics required of molding compounds to cope with surface-mounting methods are given

Keywords

circuit reliability; packaging; polymers; printed circuit manufacture; reliability; soldering; stress analysis; surface mount technology; thermal stresses; PCB manufacture; SMD mounting; cracking; epoxy molding compound; high temperatures; humidity resistance reduction; packages; quality deterioration; soldering; stress analysis; surface-mounted devices; thermal stress; Electronic packaging thermal management; Humidity; Resins; Soldering; Surface cracks; Surface resistance; Temperature; Thermal resistance; Thermal stresses; Water storage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77850

Filename

77850