SIM: new, versatile polymers for electronic industries

Author

Lee, Chung J.

Author_Institution

Occidental Chem. Corp., Grand Island, NY, USA

fYear

1989

fDate

22-24 May 1989

Firstpage

896

Lastpage

900

Abstract

SIM, a new class of soluble, fully imidized polyimidesiloxanes, is discussed. The electronic-grade SIM materials feature an advantageous combination of high tensile strength, T_g(>200°C), thermal stability, flame and chemical resistance with low water absorption, dielectric constant <3.0, and modulus. Various SIM materials are tailor-made for applications such as interlayer dielectrics in multilevel interconnections and for passivation of ICs, encapsulant, adhesives for die attachment and polyimides used in flexible circuit board, and halogen-free jackets for wires and cables. Their performance is compared with that of various commercial polyimides, silicone gels, epoxies, and other high-performance engineering plastics

Keywords

cable insulation; dielectric materials; encapsulation; flameproofing; integrated circuit technology; organic insulating materials; passivation; polymers; printed circuits; 200 degC; ICs; SIM; adhesives; cables; chemical resistance; die attachment; electronic grade material; encapsulant; flame resistance; flexible circuit board; fully imidized polyimidesiloxanes; halogen-free jackets; high tensile strength; interlayer dielectrics; low dielectric constant; low modulus; low water absorption; multilevel interconnections; passivation; polyimides; soluble polymer; thermal stability; wires; Absorption; Chemicals; Circuit stability; Dielectric materials; Electronics industry; Fires; Polyimides; Polymers; Thermal resistance; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components Conference, 1989. Proceedings., 39th

Conference_Location

Houston, TX

Type

conf

DOI

10.1109/ECC.1989.77852

Filename

77852