• DocumentCode
    2971573
  • Title

    Extraction of circuit models for substrate cross-talk

  • Author

    Smedes, T. ; Van Der Meijs, N.P. ; van Genderen, A.J.

  • Author_Institution
    Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
  • fYear
    1995
  • fDate
    5-9 Nov. 1995
  • Firstpage
    199
  • Lastpage
    206
  • Abstract
    An increasingly urgent topic for the realization of densely packed (mixed signal) integrated circuits is prevention of cross-talk via the substrate. The paper proposes a boundary element method (BEM) for calculating an admittance matrix for the substrate in order to analyze the parasitic coupling during layout verification. In contrast to standard BE methods, we propose a Green´s function which is specific to the domain and the problem. This allows minimal discretization and a direct extraction of circuit models for the cross-talk. The extraction can be combined with an efficient model reduction technique to obtain more simple, yet accurate models for the cross-talk. The complete extraction process has a linear time complexity and a constant memory usage. The method is fully implemented and integrated in an existing layout-to-circuit extractor.
  • Keywords
    Green´s function methods; boundary-elements methods; circuit layout CAD; computational complexity; crosstalk; electric admittance; integrated circuit layout; integrated circuit modelling; mixed analogue-digital integrated circuits; admittance matrix; boundary element method; circuit model extraction; constant memory usage; densely packed integrated circuits; layout verification; layout-to-circuit extractor; linear time complexity; minimal discretization; mixed signal integrated circuits; model reduction technique; parasitic coupling; substrate cross-talk prevention; Analytical models; Boundary element methods; Circuit simulation; Coupling circuits; Design automation; Integrated circuit interconnections; Integrated circuit technology; Mixed analog digital integrated circuits; Numerical analysis; Parasitic capacitance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 1995. ICCAD-95. Digest of Technical Papers., 1995 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-8186-8200-0
  • Type

    conf

  • DOI
    10.1109/ICCAD.1995.480013
  • Filename
    480013