A thermally self-cleaning synthetic flux system for tinning processes

An organic synthetic flux system consisting of monomer molecules that do not polymerize on exposure to heat, which was developed for tinning processes, is discussed. These fluxes provide assistance in the wetting of the surface of interest during the tinning process and evaporate by the end of the thermal excursion. they have been characterized by thermogravimetric analyses (TGA). Copper surfaces tinned with synthetic fluxes have been examined. In order to accomplish this fluxing and thermal self-cleaning action, the fluxing and furnace profile parameters have been optimized. Copper surfaces tinned with eutectic lead-tin solder and synthetic flux showed 100% wettability. In the case of relatively thick oxide coating on copper, it was found necessary to first clean the copper surface by high-temperature interaction with hydrogen or forming gas