• DocumentCode
    2971827
  • Title

    Development of a high frequency (35 MHz) linear ultrasonic array using 2-2 composite elements [biomedical applications]

  • Author

    Cannata, M. ; Zhou, Q.F. ; Shung, K.K.

  • Author_Institution
    Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    23-27 Aug. 2004
  • Firstpage
    894
  • Abstract
    This paper discusses the development of a 35 MHz composite ultrasonic array. This array was designed primarily for ocular imaging applications, and features 2-2 composite elements mechanically diced out of a fine grain high density Navy VI ceramic. Array elements were spaced at a 50 μm pitch, interconnected via a custom flexible circuit and matched to the 50 Ω system electronics via a 78 Ω transmission line coaxial cable. Elevation, or off axis, focusing was achieved using a cylindrical epoxy lens. A 64-element array was fabricated and tested, yielding promising results. An average center frequency of 34 MHz was achieved with an average -6 dB bandwidth of 57.8 % and average -20 dB pulse length of 102 ns. The maximum combined electrical and acoustical crosstalk between adjacent or next adjacent elements was less than -24 dB. The 35 MHz array developed is capable of resolving structures in the human body that are smaller than 0.1 mm.
  • Keywords
    biomedical ultrasonics; ceramic packaging; image resolution; ultrasonic focusing; ultrasonic transducer arrays; 0.1 mm; 102 ns; 34 MHz; 35 MHz; 50 micron; 50 ohm; 78 ohm; combined electrical/acoustical crosstalk; cylindrical epoxy lens; elevation focusing; fine grain high density ceramic; flexible circuit; high frequency linear ultrasonic array; human body structure imaging resolution; ocular imaging; off axis focusing; transmission line coaxial cable; ultrasonic array composite elements; Biomedical imaging; Ceramics; Coaxial cables; Distributed parameter circuits; Flexible printed circuits; Focusing; Frequency; Integrated circuit interconnections; Lenses; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2004 IEEE
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-8412-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2004.1417879
  • Filename
    1417879