• DocumentCode
    2972256
  • Title

    Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate

  • Author

    Ding, Yan ; Wu, Ke

  • Author_Institution
    Ecole Polytech, Montreal
  • fYear
    2007
  • fDate
    3-8 June 2007
  • Firstpage
    1555
  • Lastpage
    1558
  • Abstract
    This paper presents a novel transition between a microstrip line and a substrate integrated waveguide (SIW) in a multilayer substrate design environment. In order to achieve a broadband response, a transition, consisting of a tapered ridged SIW and a tapered microstrip line, is modeled and designed by considering simultaneously both impedance matching and field matching. An effective bandwidth of 14.5% at 15 dB return loss is obtained. This transition provides a way to design substrate integrated circuits (SICs) with buried microstrip circuits in multilayer substrate, and any transform ratio can be anticipated in the design. A design guideline is also developed in this work.
  • Keywords
    impedance matching; microstrip transitions; ridge waveguides; substrates; impedance matching; microstrip lines; multilayer substrate; substrate integrated circuits; substrate integrated waveguide-to-microstrip transition; Circuits; Coplanar waveguides; Microstrip; Nonhomogeneous media; Planar waveguides; Q factor; Rectangular waveguides; Silicon carbide; Substrates; Waveguide transitions; Ridge waveguides; microstrip; planar waveguides; waveguide transitions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium, 2007. IEEE/MTT-S International
  • Conference_Location
    Honolulu, HI
  • ISSN
    0149-645X
  • Print_ISBN
    1-4244-0688-9
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2007.380571
  • Filename
    4264140