DocumentCode
2972256
Title
Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate
Author
Ding, Yan ; Wu, Ke
Author_Institution
Ecole Polytech, Montreal
fYear
2007
fDate
3-8 June 2007
Firstpage
1555
Lastpage
1558
Abstract
This paper presents a novel transition between a microstrip line and a substrate integrated waveguide (SIW) in a multilayer substrate design environment. In order to achieve a broadband response, a transition, consisting of a tapered ridged SIW and a tapered microstrip line, is modeled and designed by considering simultaneously both impedance matching and field matching. An effective bandwidth of 14.5% at 15 dB return loss is obtained. This transition provides a way to design substrate integrated circuits (SICs) with buried microstrip circuits in multilayer substrate, and any transform ratio can be anticipated in the design. A design guideline is also developed in this work.
Keywords
impedance matching; microstrip transitions; ridge waveguides; substrates; impedance matching; microstrip lines; multilayer substrate; substrate integrated circuits; substrate integrated waveguide-to-microstrip transition; Circuits; Coplanar waveguides; Microstrip; Nonhomogeneous media; Planar waveguides; Q factor; Rectangular waveguides; Silicon carbide; Substrates; Waveguide transitions; Ridge waveguides; microstrip; planar waveguides; waveguide transitions;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location
Honolulu, HI
ISSN
0149-645X
Print_ISBN
1-4244-0688-9
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2007.380571
Filename
4264140
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