Title :
High Value Passive Component Integration in LTCC Technology
Author :
Hoppenjans, Eric E. ; Chappell, William J.
Author_Institution :
Purdue Univ., West Lafayette
Abstract :
This paper presents the use of a unique component geometry to fabricate large valued inductors buried in an LTCC substrate. The large valued inductors presented create a self shielding buried component that require no external shields to isolate the inductor from other components in the circuit. As a demonstration of the usefulness of such a component, an example SAW filter matching circuit is discussed. The performance of the SAW filter and integrated matching circuit is also presented.
Keywords :
ceramics; surface acoustic wave filters; LTCC technology; SAW filter matching circuit; component geometry; high value passive component integration; inductors; integrated matching circuit; self shielding buried component; Capacitors; Conducting materials; Educational institutions; Impedance; Inductors; Microwave frequencies; Packaging; Printed circuits; SAW filters; System-on-a-chip; filters; passive circuits;
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0688-9
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2007.380147