• DocumentCode
    2974180
  • Title

    High Value Passive Component Integration in LTCC Technology

  • Author

    Hoppenjans, Eric E. ; Chappell, William J.

  • Author_Institution
    Purdue Univ., West Lafayette
  • fYear
    2007
  • fDate
    3-8 June 2007
  • Firstpage
    1913
  • Lastpage
    1916
  • Abstract
    This paper presents the use of a unique component geometry to fabricate large valued inductors buried in an LTCC substrate. The large valued inductors presented create a self shielding buried component that require no external shields to isolate the inductor from other components in the circuit. As a demonstration of the usefulness of such a component, an example SAW filter matching circuit is discussed. The performance of the SAW filter and integrated matching circuit is also presented.
  • Keywords
    ceramics; surface acoustic wave filters; LTCC technology; SAW filter matching circuit; component geometry; high value passive component integration; inductors; integrated matching circuit; self shielding buried component; Capacitors; Conducting materials; Educational institutions; Impedance; Inductors; Microwave frequencies; Packaging; Printed circuits; SAW filters; System-on-a-chip; filters; passive circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium, 2007. IEEE/MTT-S International
  • Conference_Location
    Honolulu, HI
  • ISSN
    0149-645X
  • Print_ISBN
    1-4244-0688-9
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2007.380147
  • Filename
    4264236