DocumentCode
2974248
Title
Modeling of Spurious Coupling Between Modes in Metal Packages and Embedded Circuits
Author
Bolz, T. ; Held, S. ; Neinhus, M. ; Beyer, A. ; Solbach, Klaus
Author_Institution
IMST GmbH, Kamp-Lintfort
fYear
2007
fDate
3-8 June 2007
Firstpage
1927
Lastpage
1930
Abstract
The consideration of electromagnetic interaction between spurious modes in metal packages and its enclosed microwave circuit (MMIC) in a circuit simulator is an important topic in circuit design. In this paper a novel method is described to determine mutual coupling networks for incorporation of this parasitic coupling into a SPICE based circuit simulator. For simple package shapes the coupling networks can be determined analytically, whereas full-wave simulations are needed for more complex ones. To shorten the duration, time-domain simulators need for analyzing a high-Q structure, Prony´s method is applied to extract circuit parameters from short time sequences.
Keywords
MMIC; SPICE; electromagnetic coupling; MMIC; SPICE based circuit simulator; electromagnetic coupling; metal electronic packages; microwave circuit; spurious coupling; Analytical models; Circuit simulation; Circuit synthesis; Coupling circuits; MMICs; Microwave circuits; Mutual coupling; Packaging; SPICE; Shape; Coupled mode analysis; Coupling circuits; Electromagnetic coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location
Honolulu, HI
ISSN
0149-645X
Print_ISBN
1-4244-0687-0
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2007.380187
Filename
4264240
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