• DocumentCode
    2974248
  • Title

    Modeling of Spurious Coupling Between Modes in Metal Packages and Embedded Circuits

  • Author

    Bolz, T. ; Held, S. ; Neinhus, M. ; Beyer, A. ; Solbach, Klaus

  • Author_Institution
    IMST GmbH, Kamp-Lintfort
  • fYear
    2007
  • fDate
    3-8 June 2007
  • Firstpage
    1927
  • Lastpage
    1930
  • Abstract
    The consideration of electromagnetic interaction between spurious modes in metal packages and its enclosed microwave circuit (MMIC) in a circuit simulator is an important topic in circuit design. In this paper a novel method is described to determine mutual coupling networks for incorporation of this parasitic coupling into a SPICE based circuit simulator. For simple package shapes the coupling networks can be determined analytically, whereas full-wave simulations are needed for more complex ones. To shorten the duration, time-domain simulators need for analyzing a high-Q structure, Prony´s method is applied to extract circuit parameters from short time sequences.
  • Keywords
    MMIC; SPICE; electromagnetic coupling; MMIC; SPICE based circuit simulator; electromagnetic coupling; metal electronic packages; microwave circuit; spurious coupling; Analytical models; Circuit simulation; Circuit synthesis; Coupling circuits; MMICs; Microwave circuits; Mutual coupling; Packaging; SPICE; Shape; Coupled mode analysis; Coupling circuits; Electromagnetic coupling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium, 2007. IEEE/MTT-S International
  • Conference_Location
    Honolulu, HI
  • ISSN
    0149-645X
  • Print_ISBN
    1-4244-0687-0
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2007.380187
  • Filename
    4264240