• DocumentCode
    2974518
  • Title

    Modeling of Mutual Coupling Between Electromagnetic and Thermal Fields in Microwave Heating

  • Author

    Pauli, M. ; Kayser, T. ; Adamiuk, G. ; Wiesbeck, W.

  • Author_Institution
    Univ. Karlsruhe, Karlsruhe
  • fYear
    2007
  • fDate
    3-8 June 2007
  • Firstpage
    1983
  • Lastpage
    1986
  • Abstract
    This paper presents the analysis and modeling of the mutual coupling between thermal and electromagnetic fields. During the microwave heating process the microwaves are dissipated to heat due to the dielectric losses of the medium. The heat propagation inside the medium depends on its thermal parameters as well as on different propagation mechanisms. In most cases the dielectric properties are dependent on the temperature. In this paper a model is described for a microwave assisted soil decontamination system. The dielectric properties of the soil not only depend on temperature but also on the moisture content which reduces during the heating process. With changing dielectric properties of the soil the electromagnetic field distribution changes as well which again has an influence of the heat propagation. The basic principles of microwave heating and heat propagation are explained in this paper, as well as a simulation model based on an FEM code. To prove the correctness of the model a comparison with measurement results is given.
  • Keywords
    dielectric losses; electromagnetic coupling; electromagnetic fields; finite element analysis; microwave heating; radiation decontamination; soil; FEM code; dielectric losses; dielectric properties; electromagnetic field distribution; heat propagation; microwave assisted soil decontamination system; microwave heating process; mutual coupling; thermal fields; Dielectric losses; Electromagnetic coupling; Electromagnetic fields; Electromagnetic heating; Electromagnetic modeling; Electromagnetic propagation; Microwave propagation; Mutual coupling; Soil; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium, 2007. IEEE/MTT-S International
  • Conference_Location
    Honolulu, HI
  • ISSN
    0149-645X
  • Print_ISBN
    1-4244-0688-9
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2007.380201
  • Filename
    4264254