DocumentCode
2974700
Title
Knowledge sharing in an electronics manufacturing firm: Evidence from Malaysia
Author
Fathi, Nurliza Mohammed ; Eze, Uchenna C. ; Goh, G.G.G.
Author_Institution
Fac. of Eng. Technol., Multimedia Univ., Cyberjaya, Malaysia
fYear
2009
fDate
8-11 Dec. 2009
Firstpage
44
Lastpage
48
Abstract
The objective of this paper is to determine the knowledge sharing behavioral intentions among employees. We developed nine hypotheses on the behavioral intentions of employees with respect to sharing knowledge, which are grounded on theory. In addition, we used 141 valid survey responses from an electronics manufacturing firm in Malaysia and analyzed the data using correlation and regression statistical techniques. The findings in this paper could help provide some materials that managers could use to improve knowledge sharing capacity in a manufacturing firm, which may be useful in related areas such as product life cycle, new product development and customer services. Managers could also use the results to seek for avenues to encourage knowledge sharing among employees in the firm. This paper contributes to the existing body of literature on knowledge sharing. The findings and explanation for the hypotheses are discussed including the implications for research, practice and suggestion for future research.
Keywords
correlation methods; electronics industry; knowledge management; organisational aspects; personnel; regression analysis; Malaysia; correlation techniques; electronics manufacturing firm; employees; knowledge sharing; regression statistical techniques; Companies; Consumer electronics; Customer service; Data analysis; Economic indicators; Knowledge engineering; Knowledge management; Product development; Pulp manufacturing; Semiconductor device manufacture; Attitude towards Knowledge Sharing; Electronics Manufacturing Firm; Knowledge Sharing; Malaysia;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-4869-2
Electronic_ISBN
978-1-4244-4870-8
Type
conf
DOI
10.1109/IEEM.2009.5373452
Filename
5373452
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