The Use of Shape Memory Polymers for Microassembly by Transfer Printing

Author

Eisenhaure, Jeffrey D. ; Sang Il Rhee ; Al-Okaily, Ala´a M. ; Carlson, Andrew ; Ferreira, Pedro M. ; Seok Kim

Author_Institution

Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA

Volume

23

Issue

5

fYear

2014

fDate

Oct. 2014

Firstpage

1012

Lastpage

1014

Abstract

The advantages of utilizing the polymeric shape memory effect for deterministic assembly of microscale objects are explored in this letter. The assembly is performed by transfer printing, which involves a polymeric stamp with reversible adhesion as a manipulator. The dynamic rigidity control afforded by heating or cooling a shape memory polymer (SMP) stamp across its glass transition temperature allows for a dramatic increase in adhesion during pick-up. Furthermore, the shape-fixing and recovery property of the SMP material enables substantial freedom in stamp design, such as more complex surface patterning and heterogeneous surface features to further reduce adhesion during release not otherwise available.

Keywords

adhesion; lithography; microassembling; micromechanical devices; polymers; shape memory effects; SMP material; SMP stamp; deterministic assembly; dynamic rigidity control; glass transition temperature; heterogeneous surface features; microassembly; microscale objects; polymeric shape memory effect; polymeric stamp; reversible adhesion; shape memory polymer stamp; surface patterning; transfer printing; Adhesives; Assembly; Ink; Plastics; Printing; Shape; Silicon; Shape memory polymer; dry adhesives; microassembly; reversible adhesion; transfer printing;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2014.2345274

Filename

6879234