Title :
The Use of Shape Memory Polymers for Microassembly by Transfer Printing
Author :
Eisenhaure, Jeffrey D. ; Sang Il Rhee ; Al-Okaily, Ala´a M. ; Carlson, Andrew ; Ferreira, Pedro M. ; Seok Kim
Author_Institution :
Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Champaign, IL, USA
Abstract :
The advantages of utilizing the polymeric shape memory effect for deterministic assembly of microscale objects are explored in this letter. The assembly is performed by transfer printing, which involves a polymeric stamp with reversible adhesion as a manipulator. The dynamic rigidity control afforded by heating or cooling a shape memory polymer (SMP) stamp across its glass transition temperature allows for a dramatic increase in adhesion during pick-up. Furthermore, the shape-fixing and recovery property of the SMP material enables substantial freedom in stamp design, such as more complex surface patterning and heterogeneous surface features to further reduce adhesion during release not otherwise available.
Keywords :
adhesion; lithography; microassembling; micromechanical devices; polymers; shape memory effects; SMP material; SMP stamp; deterministic assembly; dynamic rigidity control; glass transition temperature; heterogeneous surface features; microassembly; microscale objects; polymeric shape memory effect; polymeric stamp; reversible adhesion; shape memory polymer stamp; surface patterning; transfer printing; Adhesives; Assembly; Ink; Plastics; Printing; Shape; Silicon; Shape memory polymer; dry adhesives; microassembly; reversible adhesion; transfer printing;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2014.2345274
