Title :
Small Form-Factor Integrated Passive Devices for SiP Applications
Author :
Liu, Kai ; Frye, Robert C.
Author_Institution :
STATS ChipPAC Inc., Tempe
Abstract :
Higher level of integration has been seen to be the trend of package for wireless communication products. Integration of passive components (e.g. RCL and filters) plays a significant role in the overall size-reduction for system in packaging (SiP) applications. We have developed an integrated passive device (IPD) process using silicon technology to make miniaturized RF components. Advanced design methodology was used to realize fast design cycle-time. Some example IPDs are described in this paper. The manufactured samples have small form-factors and excellent electrical performance. The size of the LPF IPD working at 850 MHz is 1.1 times 0.85 times 0.35 mm3, which is by far the smallest IPD of its kind. The board effect when IPD is in flip-chip configuration was extensively investigated through using HFSS EM simulation and experimental verification. Very good agreement between simulated and measured results validates our design process.
Keywords :
flip-chip devices; radiofrequency integrated circuits; system-in-package; HFSS EM simulation; SiP application; flip-chip configuration; frequency 850 MHz; integrated passive device; silicon technology; system in packaging; wireless communication product; Active inductors; Capacitors; Filters; Packaging; Q factor; Radio frequency; Silicon; Substrates; Thin film inductors; Wireless communication; EM simulation; Integrated Passive Device; System in Package; filter; flip-chip;
Conference_Titel :
Microwave Symposium, 2007. IEEE/MTT-S International
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-0688-9
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2007.380306
