DocumentCode
2975580
Title
EMI suppression for high-speed PCB
Author
Tang, Tzu-Chiang ; Ho, Chian C.
Author_Institution
Dept. of R&D Supporting, Chunghwa Telecom Labs., Taoyuan
fYear
2009
fDate
8-13 Feb. 2009
Firstpage
168
Lastpage
172
Abstract
This paper studies two popular examples of high-speed Printed Circuit Board (PCB), portable embedded devices and industrial computers, through measurement of 10-m semi-anechoic chamber in ChungHwa Telecom Labs, and proposes some simple but practical remedies to reduce their Electromagnetic Interference (EMI). In the first example, EMI of portable embedded devices can be simply prevented by an iron case rather than an aluminum alloy case. Besides, this paper develops iron shielding sheets to further suppress EMI of critical on-board ICs. The measurement result verifies the suppression effect of iron shielding sheets is much better than that of rubber microwave absorbing patches. In the second example, EMI of industrial computers can be effectively blocked by the well-made chassis. In addition, the shunt capacitor can further suppress dominant EMI from the pulse regenerator, but its suppression effect at some spectrum is limited. To overcome this limitation, this paper proposes and verifies the copper foil is the best alternate.
Keywords
electromagnetic interference; interference suppression; printed circuit design; EMI suppression; high speed PCB; industrial computers; portable embedded devices; pulse regenerator; suppression effect; Aluminum alloys; Communication industry; Computer industry; Electromagnetic interference; Electromagnetic measurements; Embedded computing; Iron; Portable computers; Printed circuits; Telecommunication computing;
fLanguage
English
Publisher
ieee
Conference_Titel
Waveform Diversity and Design Conference, 2009 International
Conference_Location
Kissimmee, FL
Print_ISBN
978-1-4244-2970-7
Electronic_ISBN
978-1-4244-2971-4
Type
conf
DOI
10.1109/WDDC.2009.4800338
Filename
4800338
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