DocumentCode
2976667
Title
Influence of Si surface on damage generation and recombination
Author
Santos, Iván ; Marqués, Luis A. ; Pelaz, Lourdes ; López, Pedro ; Aboy, María
Author_Institution
Dept. de Electr. y Electron., Univ. de Valladolid, Valladolid
fYear
2009
fDate
11-13 Feb. 2009
Firstpage
50
Lastpage
53
Abstract
We have studied the influence of Si surface on damage generation and recombination using classical molecular dynamics simulations. We have found that, when approaching to the surface, damage generation is enhanced due to weaker atomic bonding. Furthermore, generated damage is more stable as it reveals the mean lifetime of defects and the activation energy for recombination. Therefore near the surface damage is generated easily and it is more stable than in the bulk. These findings explain the experimental observations of a reduced amorphization threshold for the formation of ultra-shallow junctions and the difficulty to regrowth ultra thin body Si devices.
Keywords
MOSFET; amorphisation; carrier lifetime; elemental semiconductors; molecular dynamics method; semiconductor junctions; silicon; surface recombination; Si; activation energy; amorphization; atomic bonding; defect mean lifetime; metal-oxide-semiconductor field effect transistors; molecular dynamics simulations; recombination; surface damage; ultra thin body devices; ultra-shallow junctions; Amorphous materials; Annealing; Bonding; Electron devices; FETs; Lattices; Leakage current; Spontaneous emission; Stability; Telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices, 2009. CDE 2009. Spanish Conference on
Conference_Location
Santiago de Compostela
Print_ISBN
978-1-4244-2838-0
Electronic_ISBN
978-1-4244-2839-7
Type
conf
DOI
10.1109/SCED.2009.4800427
Filename
4800427
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