• DocumentCode
    2976667
  • Title

    Influence of Si surface on damage generation and recombination

  • Author

    Santos, Iván ; Marqués, Luis A. ; Pelaz, Lourdes ; López, Pedro ; Aboy, María

  • Author_Institution
    Dept. de Electr. y Electron., Univ. de Valladolid, Valladolid
  • fYear
    2009
  • fDate
    11-13 Feb. 2009
  • Firstpage
    50
  • Lastpage
    53
  • Abstract
    We have studied the influence of Si surface on damage generation and recombination using classical molecular dynamics simulations. We have found that, when approaching to the surface, damage generation is enhanced due to weaker atomic bonding. Furthermore, generated damage is more stable as it reveals the mean lifetime of defects and the activation energy for recombination. Therefore near the surface damage is generated easily and it is more stable than in the bulk. These findings explain the experimental observations of a reduced amorphization threshold for the formation of ultra-shallow junctions and the difficulty to regrowth ultra thin body Si devices.
  • Keywords
    MOSFET; amorphisation; carrier lifetime; elemental semiconductors; molecular dynamics method; semiconductor junctions; silicon; surface recombination; Si; activation energy; amorphization; atomic bonding; defect mean lifetime; metal-oxide-semiconductor field effect transistors; molecular dynamics simulations; recombination; surface damage; ultra thin body devices; ultra-shallow junctions; Amorphous materials; Annealing; Bonding; Electron devices; FETs; Lattices; Leakage current; Spontaneous emission; Stability; Telecommunications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices, 2009. CDE 2009. Spanish Conference on
  • Conference_Location
    Santiago de Compostela
  • Print_ISBN
    978-1-4244-2838-0
  • Electronic_ISBN
    978-1-4244-2839-7
  • Type

    conf

  • DOI
    10.1109/SCED.2009.4800427
  • Filename
    4800427