• DocumentCode
    2977333
  • Title

    3D Parallel Finite Element Monte Carlo Simulator With Quantum Corrections Using Density Gradient Approach

  • Author

    Aldegunde, Manuel ; Garcia-Loureiro, Antonio J. ; Seoane, Natalia ; Martinez, Antonio ; Kalna, Karol

  • Author_Institution
    Dept. de Electron. y Comput., Univ. de Santiago de Compostela, Santiago de Compostela
  • fYear
    2009
  • fDate
    11-13 Feb. 2009
  • Firstpage
    207
  • Lastpage
    210
  • Abstract
    Novel thin-body architectures with non-planar geometries are foreseen to replace bulk devices at the 18 nm gate length technology and beyond because they have a superior control of electrostatic and can deliver the 2008 ITRS prescribed on-current. We report on the development of a parallel 3D Monte Carlo simulator which uses unstructured tetrahedral elements to describe the geometry of these new architectures. We also describe an incorporation of quantum corrections using the density gradient method since the quantum confinement plays an important role. Finally, we present test simulations of a 10 nm gate length double gate MOSFET with a body thickness of 6 nm, presenting the approach to minimise the magnitude of self forces originating from the use of tetrahedral elements.
  • Keywords
    MOSFET; Monte Carlo methods; finite element analysis; quantum theory; semiconductor device testing; 3D parallel finite element Monte Carlo simulator; density gradient approach; double gate MOSFET; quantum confinement; quantum correction; size 10 nm; size 6 nm; unstructured tetrahedral element; Computational geometry; Computational modeling; Computer architecture; Concurrent computing; Finite element methods; Monte Carlo methods; Potential well; Quantum computing; Quantum mechanics; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices, 2009. CDE 2009. Spanish Conference on
  • Conference_Location
    Santiago de Compostela
  • Print_ISBN
    978-1-4244-2838-0
  • Electronic_ISBN
    978-1-4244-2839-7
  • Type

    conf

  • DOI
    10.1109/SCED.2009.4800467
  • Filename
    4800467