MEMS switches fabrication using photoresist as a sacrificial layer

This paper describes a reliability study of the micro-electromechanical system fabrication with a photoresist layer used as sacrificial layer with an aluminum beam deposited by means of RF sputtering method. This work reports changes of the roughness and planarity of the sacrificial layer beneath the aluminum film following the sputtering deposition. Such changes may be attributed to the alteration of the photoresist properties due principally to the outgassing of hydrogen by decomposition of C-H bonds under argon plasma. A safe deposition parameters area was identified where the photoresist layer keeps its properties and may be used as sacrificial layer.