• DocumentCode
    2977752
  • Title

    Microneedles electrodes for living cells

  • Author

    Duch, M. ; López, M.J. ; Gómez, R. ; Esteve, J. ; Plaza, J.A.

  • Author_Institution
    Inst. of Microelectron. of Barcelona IMB-CNM, CSIC, Barcelona
  • fYear
    2009
  • fDate
    11-13 Feb. 2009
  • Firstpage
    297
  • Lastpage
    300
  • Abstract
    This paper shows the technology development of microneedles electrodes for living cell applications. The study includes the fabrication of cantilever electrodes to monitor individual cells. The technology is based on silicon micromachining by combining deep reactive ion etching and focused ion beam (FIB) nanomachining. Cell biology applications require micrometer size electrodes, smaller than living cells (~20 mum), and biocompatible materials. The metal electrode is fabricated in aluminum and passivated by silicon oxide. The opening of the tip electrode by FIB is also performed. Finally, the tip of the electrode is covered by a nanometer thick gold layer deposited by electroless to improved biocompatibility and electrochemical conductivity. The study also addresses questions concerning to the pre-treatment of the aluminum layer before gold deposition in other to improve the adherence and conductivity.
  • Keywords
    aluminium; bioMEMS; biological techniques; cantilevers; cellular biophysics; electrochemical electrodes; electroless deposition; gold; microelectrodes; micromachining; passivation; silicon; silicon compounds; sputter etching; Microneedles electrodes; Si-Al-Au; aluminum; biocompatible materials; cantilever electrodes; cell biology; deep reactive ion etching; electrochemical conductivity; electroless deposition; focused ion beam nanomachining; living cells; metal electrode; nanometer thick gold layer; passivation; silicon micromachining; size 20 mum; Aluminum; Conductivity; Electrodes; Etching; Fabrication; Gold; Micromachining; Monitoring; Nanobioscience; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices, 2009. CDE 2009. Spanish Conference on
  • Conference_Location
    Santiago de Compostela
  • Print_ISBN
    978-1-4244-2838-0
  • Electronic_ISBN
    978-1-4244-2839-7
  • Type

    conf

  • DOI
    10.1109/SCED.2009.4800490
  • Filename
    4800490