DocumentCode
2977752
Title
Microneedles electrodes for living cells
Author
Duch, M. ; López, M.J. ; Gómez, R. ; Esteve, J. ; Plaza, J.A.
Author_Institution
Inst. of Microelectron. of Barcelona IMB-CNM, CSIC, Barcelona
fYear
2009
fDate
11-13 Feb. 2009
Firstpage
297
Lastpage
300
Abstract
This paper shows the technology development of microneedles electrodes for living cell applications. The study includes the fabrication of cantilever electrodes to monitor individual cells. The technology is based on silicon micromachining by combining deep reactive ion etching and focused ion beam (FIB) nanomachining. Cell biology applications require micrometer size electrodes, smaller than living cells (~20 mum), and biocompatible materials. The metal electrode is fabricated in aluminum and passivated by silicon oxide. The opening of the tip electrode by FIB is also performed. Finally, the tip of the electrode is covered by a nanometer thick gold layer deposited by electroless to improved biocompatibility and electrochemical conductivity. The study also addresses questions concerning to the pre-treatment of the aluminum layer before gold deposition in other to improve the adherence and conductivity.
Keywords
aluminium; bioMEMS; biological techniques; cantilevers; cellular biophysics; electrochemical electrodes; electroless deposition; gold; microelectrodes; micromachining; passivation; silicon; silicon compounds; sputter etching; Microneedles electrodes; Si-Al-Au; aluminum; biocompatible materials; cantilever electrodes; cell biology; deep reactive ion etching; electrochemical conductivity; electroless deposition; focused ion beam nanomachining; living cells; metal electrode; nanometer thick gold layer; passivation; silicon micromachining; size 20 mum; Aluminum; Conductivity; Electrodes; Etching; Fabrication; Gold; Micromachining; Monitoring; Nanobioscience; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices, 2009. CDE 2009. Spanish Conference on
Conference_Location
Santiago de Compostela
Print_ISBN
978-1-4244-2838-0
Electronic_ISBN
978-1-4244-2839-7
Type
conf
DOI
10.1109/SCED.2009.4800490
Filename
4800490
Link To Document