DocumentCode
2977900
Title
A model for the accurate determination of the electromechanical coupling factor of thin film SAW devices on non-insulating substrates
Author
Iborra, E. ; Vergara, L. ; Sangrador, J. ; Clement, M. ; Sanz-Hervás, A. ; Olivares, J.
Author_Institution
Dpto. Tecnologia Electronica, Univ. Politecnica de Madrid, Spain
Volume
3
fYear
2004
fDate
23-27 Aug. 2004
Firstpage
1880
Abstract
We propose a circuital model that simulates the frequency response of surface acoustic wave (SAW) delay lines made on piezoelectric thin films on non-insulating substrates. The model, which takes into account the parasitic elements that distort the frequency response (due to the conductive substrate, airborne coupling and mounting), allows accurate values of the piezoelectric properties of the films (k2 and νs) to be obtained. This model has been applied to SAW delay lines made on AlN thin films deposited on different silicon substrates. We show that the values deduced for k2 if parasitic effects are not considered can be underestimated by up to 20 times.
Keywords
aluminium compounds; equivalent circuits; piezoelectric devices; piezoelectric thin films; silicon; substrates; surface acoustic wave delay lines; AlN; SAW delay lines; Si; airborne coupling; aluminium nitride thin films; conductive substrate; electromechanical coupling factor; frequency response; noninsulating substrates; parasitic elements; piezoelectric thin films; silicon substrates; surface acoustic wave delay lines; thin film SAW devices; Conductive films; Coupling circuits; Delay lines; Frequency response; Piezoelectric films; Substrates; Surface acoustic wave devices; Surface acoustic waves; Thin film circuits; Thin film devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2004 IEEE
ISSN
1051-0117
Print_ISBN
0-7803-8412-1
Type
conf
DOI
10.1109/ULTSYM.2004.1418197
Filename
1418197
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