Title :
Bonding method of semiconductor devices on piezoelectric substrate using laser enhanced flip-chip technology
Author :
Koh, Keishin ; Kaneshiro, Chinami ; Hohkawa, Kohji
Author_Institution :
Fac. of Eng., Kanagawa Inst. of Technol., Japan
Abstract :
In this paper, we report new flip-chip bonding technology with laser assist, in which, semiconductor devices can be bonded on the piezoelectric substrate with small size paste bump. We formed the paste bump with nanoparticles on the piezoelectric substrate using screen printing and used the laser to locally cure the paste bump. We investigated the bonded process conditions such as laser power, heating time and electrical properties of the bump junction. The experimental results indicate the possibilities of the new bonding technology.
Keywords :
flip-chip devices; integrated circuit bonding; nanoparticles; piezoelectric devices; semiconductor devices; surface acoustic wave devices; SAW devices; bump junction; electrical properties; flip-chip bonding; heating time; laser enhanced flip-chip technology; laser power; nanoparticles; paste bump; piezoelectric substrate; semiconductor devices; surface acoustic wave devices; Fabrication; Piezoelectric devices; Printing; Productivity; Semiconductor devices; Semiconductor lasers; Substrates; Surface acoustic wave devices; Surface acoustic waves; Wafer bonding;
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
Print_ISBN :
0-7803-8412-1
DOI :
10.1109/ULTSYM.2004.1418200
