Bonding method of semiconductor devices on piezoelectric substrate using laser enhanced flip-chip technology

Author

Koh, Keishin ; Kaneshiro, Chinami ; Hohkawa, Kohji

Author_Institution

Fac. of Eng., Kanagawa Inst. of Technol., Japan

Volume

3

fYear

2004

fDate

23-27 Aug. 2004

Firstpage

1892

Abstract

In this paper, we report new flip-chip bonding technology with laser assist, in which, semiconductor devices can be bonded on the piezoelectric substrate with small size paste bump. We formed the paste bump with nanoparticles on the piezoelectric substrate using screen printing and used the laser to locally cure the paste bump. We investigated the bonded process conditions such as laser power, heating time and electrical properties of the bump junction. The experimental results indicate the possibilities of the new bonding technology.

Keywords

flip-chip devices; integrated circuit bonding; nanoparticles; piezoelectric devices; semiconductor devices; surface acoustic wave devices; SAW devices; bump junction; electrical properties; flip-chip bonding; heating time; laser enhanced flip-chip technology; laser power; nanoparticles; paste bump; piezoelectric substrate; semiconductor devices; surface acoustic wave devices; Fabrication; Piezoelectric devices; Printing; Productivity; Semiconductor devices; Semiconductor lasers; Substrates; Surface acoustic wave devices; Surface acoustic waves; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2004 IEEE

ISSN

1051-0117

Print_ISBN

0-7803-8412-1

Type

conf

DOI

10.1109/ULTSYM.2004.1418200

Filename

1418200