DocumentCode
2978083
Title
Development of antenna-in-package technology for single-chip tri-band radio devices
Author
Zhang, Y.P.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2011
fDate
7-9 March 2011
Firstpage
136
Lastpage
139
Abstract
This paper presents my preliminary thoughts on the development of antenna-in-package (AiP) technology for single-chip tri-band radio devices operating in the 2.4, 5, and 60 GHz bands based on microstrip patch antennas by exploring the novel patch-by-patch and patch-in-patch schemes. It is found that impedance bandwidth is not wide enough to cover the whole 60 GHz band. Thus, either bandwidth enhancement needs to be done or choice of other antenna types should be made in the next-step development.
Keywords
UHF antennas; electronics packaging; microstrip antennas; millimetre wave antennas; multifrequency antennas; antenna-in-package technology; bandwidth enhancement; frequency 2.4 GHz; frequency 5 GHz; frequency 60 GHz; microstrip patch antennas; single-chip triband radio devices; Ceramics; Dual band; Microstrip; Microstrip antennas; Patch antennas;
fLanguage
English
Publisher
ieee
Conference_Titel
Antenna Technology (iWAT), 2011 International Workshop on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-9133-9
Type
conf
DOI
10.1109/IWAT.2011.5752287
Filename
5752287
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