• DocumentCode
    2978188
  • Title

    Highly Strained InGaAs Quantum Well with GaAs Strain Compensating Layer on InGaAs Ternary Substrate for 1.3 μm Laser

  • Author

    Arai, Masakazu ; Kinoshita, Kyoichi ; Yoda, Shinichi ; Kondo, Yuta

  • Author_Institution
    NTT Corp., Atsugi
  • fYear
    2007
  • fDate
    14-18 May 2007
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    We have developed highly strained InGaAs quantum wells (QWs) with a 1.3 μm-band emission on a low indium content InGaAs ternary substrate using low temperature metal-organic vapor phase epitaxy (MOVPE). The indium content of the substrate is 0.1, and this has the advantage of providing good thermal conductivity and good crystal quality. In this study, we newly introduced a binary GaAs barrier layer for strain compensation. We performed photoluminescence (PL) and transmission electron microscope (TEM) measurements to confirm that the crystal quality had improved. We realized a broad area laser with GaAs strain compensation that achieved low threshold current operation.
  • Keywords
    III-V semiconductors; MOCVD; gallium arsenide; indium compounds; optical materials; photoluminescence; quantum well lasers; semiconductor growth; thermal conductivity; transmission electron microscopy; vapour phase epitaxial growth; InGaAs-GaAs; MOVPE; TEM; binary barrier layer; crystal quality; highly-strained quantum well laser; low-temperature metal-organic vapor phase epitaxy; low-threshold current operation; photoluminescence; strain compensating layer; ternary substrate; thermal conductivity; transmission electron microscope; wavelength 1.3 μm; Capacitive sensors; Epitaxial growth; Epitaxial layers; Gallium arsenide; Indium gallium arsenide; Performance evaluation; Quantum well lasers; Substrates; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide & Related Materials, 2007. IPRM '07. IEEE 19th International Conference on
  • Conference_Location
    Matsue
  • ISSN
    1092-8669
  • Print_ISBN
    1-4244-0874-1
  • Electronic_ISBN
    1092-8669
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2007.381168
  • Filename
    4265925