Title :
Using contract manufacturing services to assist with design solutions in advanced packaging technologies
Author :
Toth, Gabor A. ; Hyora, R. Wyatt
Author_Institution :
Wytan Co., Golden, CO, USA
Abstract :
Electronic product companies (OEMs) face difficult problems today when dealing with the many divergent demand of bringing new products to market. These demands include: Higher system performance; greater feature set; reduced costs; reduced size and weight. Responding to these demands, engineers are increasingly turning to advanced packaging technologies for solutions. However, the best results from these technologies are often obtained only when non-traditional design approaches are used. Designers often overlook valuable resources when they are first exploring advanced packaging alternatives-contract manufacturers. Many of them are experienced with a variety of these technologies and offer their customers design services as well as production services
Keywords :
design engineering; electronic equipment manufacture; packaging; advanced packaging technologies; contract manufacturing services; design services; production services; Chip scale packaging; Contracts; Costs; Electronics packaging; Flip chip; Integrated circuit interconnections; Manufacturing; Product design; Production; Semiconductor device packaging;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3929-0
DOI :
10.1109/IEMT.1997.626933