Title :
SAW substrate, with coupling factor and excellent temperature stability suitable for duplexer of PCS in US
Author :
Kadota, Michio ; Nakao, Takeshi ; Taniguchi, Norio ; Takata, Eiichi ; Mimura, Masakazu ; Nishiyama, Kenji ; Hada, Takuo ; Komura, Tomohisa
Author_Institution :
Murata Manuf. Co. Ltd., Kyoto, Japan
Abstract :
The pass-bands of a transmission (Tx) and a receiving (Rx) of the Personal Communication Services (PCS) Handy-phone in US are 1850-1910 MHz and 1930-1990 MHz, respectively. The transition bandwidth between the Tx and the Rx is very narrow as 20 MHz compared with other systems. A duplexer for the PCS using surface acoustic wave (SAW) requires a SAW substrate, which has a the good temperature stability, an optimum electromechanical coupling factor, and a large reflection coefficient. Some Rayleigh waves and leaky SAW (LSAW) on various substrate or structures have a good temperature characteristic, but almost all of them have not an optimum coupling factor and a large reflection coefficient for the US-PCS duplexer. In 2003, the authors reported a US-PCS SAW duplexer having good temperature stability, a steep frequency characteristic in transition band, a low loss, and a large out-of-band suppression. This paper describes the detail of the new substrate having the good temperature stability, the optimum electromechanical coupling factor, and sufficient reflection coefficient.
Keywords :
Rayleigh waves; acoustic wave reflection; electromechanical effects; personal communication networks; substrates; surface acoustic wave devices; thermal stability; 1850 to 1910 MHz; 1930 to 1990 MHz; 20 MHz; Handy-phone; LSAW; PCS; Personal Communication Services; Rayleigh waves; SAW substrate; US; coupling factor; duplexer; leaky SAW; optimum electromechanical coupling factor; out-of-band suppression; reflection coefficient; steep frequency characteristic; surface acoustic wave; temperature stability; Bandwidth; Couplings; Cutoff frequency; Film bulk acoustic resonators; Filters; Personal communication networks; Stability; Substrates; Surface acoustic waves; Temperature distribution;
Conference_Titel :
Ultrasonics Symposium, 2004 IEEE
Print_ISBN :
0-7803-8412-1
DOI :
10.1109/ULTSYM.2004.1418219