DocumentCode
2978738
Title
Silicon device pad design considerations for solder flip chip applications
Author
Kubin, Richard ; Ho, Vu
Author_Institution
Adv. Packaging Technol., Ottawa, Ont., Canada
fYear
1997
fDate
13-15 Oct 1997
Firstpage
308
Lastpage
312
Abstract
As the use of solder flip chip devices increases, it is important to ensure that the design and materials used in the die to solder bump structure are compatible with one another and provide a robust system that will meet reliability requirements. The key elements of this system are the final metal pad design, die passivation, and under bump metallization. This paper examines the interactions of these elements and offers some recommendations based on experimental observations
Keywords
elemental semiconductors; finite element analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; metallisation; passivation; silicon; soldering; FE modelling; Si; Si device pad design; die passivation; die to solder bump structure; reliability requirements; solder flip chip applications; under bump metallization; Atherosclerosis; Flip chip; Integrated circuit interconnections; Metallization; Packaging; Passivation; Shape; Silicon devices; Testing; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International
Conference_Location
Austin, TX
ISSN
1089-8190
Print_ISBN
0-7803-3929-0
Type
conf
DOI
10.1109/IEMT.1997.626936
Filename
626936
Link To Document