DocumentCode
2979021
Title
INDUCTWISE: inductance-wise interconnect simulator and extractor
Author
Chen, Tsung-Hao ; Luk, Clement ; Kim, Hyungsuk ; Chen, Charlie Chung-Ping
Author_Institution
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
fYear
2002
fDate
10-14 Nov. 2002
Firstpage
215
Lastpage
220
Abstract
We have developed a robust, efficient, and accurate tool, which integrates inductance extraction and simulation, called INDUCTWISE. This paper advances the state-of-the-art inductance extraction and simulation techniques and contains two major parts. In the first part, INDUCTWISE extractor, we discovered that the recently proposed inductance matrix sparsification algorithm, the K-method, albeit its great benefit of efficiency, has a major flaw in the stability. We provide both a counter example and a remedy for it. A window section algorithm is also presented to preserve the accuracy of the sparsification method. The second part, the INDUCTWISE simulator, demonstrates great efficiency of integrating the nodal analysis formulation with the improved K-method. Experimental results show that INDUCTWISE has over 250× speedup compared to SPICE3. The proposed sparsification algorithm accelerates the simulator another 175× and speeds up the extractor 23.4× within 0.1% of error. INDUCTWISE can extract and simulate an 118K-conductor RKC circuit within 18 minutes.
Keywords
VLSI; circuit simulation; inductance; integrated circuit interconnections; sparse matrices; INDUCTWISE; VLSI technology; improved K-method; inductance matrix sparsification algorithm; inductance-wise interconnect extractor; inductance-wise interconnect simulator; nodal analysis formulation; parasitic on-chip inductance; window section algorithm; Circuit simulation; Computational modeling; Coupling circuits; Crosstalk; Frequency; H infinity control; Inductance; Large-scale systems; Power grids; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2002. ICCAD 2002. IEEE/ACM International Conference on
ISSN
1092-3152
Print_ISBN
0-7803-7607-2
Type
conf
DOI
10.1109/ICCAD.2002.1167537
Filename
1167537
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