Thermo-mechanical deformation of underfilled flip-chip packaging

Author

Dai, Xiang ; Ho, Paul S.

Author_Institution

Interconnect & Packaging Group, Texas Univ., Austin, TX, USA

fYear

1997

fDate

13-15 Oct 1997

Firstpage

326

Lastpage

333

Abstract

An experimental technique of in-situ moire interferometry has been applied to investigate the thermo-mechanical deformations induced by to thermal loading in an underfilled flip-chip-on-board packaging. Thermo-mechanical deformations and shear strains generated from CTE mismatch are determined experimentally as a function of thermal loading. Semi-quantitative agreement is established between measured and FEA-simulated deformations. The results show that moire interferometry with in-situ thermal loading capabilities is effective for experimental studies of electronic packaging. Through this study, the role of underfill in reducing shear strains over solder bumps and thus in improving solder shear fatigue reliability is clarified. A methodology is demonstrated to differentiate effects of underfill properties on packaging thermo-mechanical performance

Keywords

deformation; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; light interferometry; moire fringes; thermal expansion; CTE mismatch; FEA-simulated deformations; electronic packaging; in-situ moire interferometry; shear strains; solder bumps; solder shear fatigue reliability; thermal loading; thermo-mechanical deformations; underfilled flip-chip packaging; Capacitive sensors; Ceramics; Electronic packaging thermal management; Fatigue; Interferometry; Strain measurement; Thermal expansion; Thermal loading; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE/CPMT International

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3929-0

Type

conf

DOI

10.1109/IEMT.1997.626939

Filename

626939